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SPECIAL EVENTS – Poster Sessions and Awards – Tutorials - Keynote Speakers
NEWLY ADDED TO THE CONFERENCE! We have recently modified the conference and encourage you to submit Posters for any of the technical tracks and sessions. Further, we will provide a competition for Best Poster at InterPACK.
Just as we provided in 2003 in Maui, Hawai'i, we will offer Tutorials in San Francisco as well. We are currently working on topics and presenters, so check back frequently for further information and specifics.
During each luncheon, we have planned special Keynote Speakers to present a variety of topics in areas important to you. Check back with us for further updates.
The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems is an International Forum for Exchange of State-of-the-Art Knowledge in Research, Development, Manufacturing, and Application in the Integration and Packaging of MEMS, NEMS, and Electronic Systems.
Sponsored by ASME with the participation of The Japan Society of Mechanical Engineers (JSME).
Conference Objectives
The InterPACK '05 Conference aims to promote international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave, MEMS and NEMS- Systems Packaging and Integration. Emerging knowledge, research results, new developments, and novel thermal/mechanical/electrical/materials packaging product concepts in Electronic Packaging Engineering will be presented in unique forums and archived in electronic conference proceedings. View a complete list of topics.
Technical Highlights
Technical information will be presented in unique forums and archived in electronic conference proceedings for future use and reference. This year's conference will provide a forum for exchange of information related to the following areas:
Telecommunications Packaging Technology Electrical Design, Simulation and Test Microelectronic Systems Photonics Airborne, Space and Defense Electronic Systems Microelectromechanical Systems (MEMS) and Nanoscale Phenomena in Electronics
Network with the Who's Who
This unprecedented collaboration between four of ASME's major technical divisions, as well as the continuing participation of the JSME and AIChE as co-sponsors, will surely make the co-located 2005 Heat Transfer Conference and InterPACK '05 Conference a MUST for your 2005 technical calendar!
International Attendees
For additional information regarding visas and letters of invitation, please view the travel information.
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