Conference Sites 2005 ASME Summer Heat Transfer Conference ASME InterPACK '05 Conference

2004 ASME Heat Transfer/Fluids Engineering Summer Conference View abstracts and purchase papers from HT-FED2004! International Electronic Packaging Technical Conference and Exhibition View abstracts and purchase papers from IPACK2003! Heat Transfer Find abstracts and prices for other papers in this technical area* * check listing for availablity Electronic and Photonic Packaging Find abstracts and prices for other papers in this technical area* * check listing for availablity Microelectromechnical Systems Find abstracts and prices for other papers in this technical area* * check listing for availablity Nanotechnology Find abstracts and prices for other papers in this technical area* * check listing for availablity Shop all ASME conference papers! • 2004 Conferences • 2003 Conferences • 2002 Conferences

Available from ASME Press... Technical Writing A-Z: A Commonsense Guide to Engineering Reports and Theses

The ASME Heat Transfer Conference and the ASME InterPACK Conference are the flagship conferences of the Heat Transfer Division (HTD) and the Electronic and Photonic Packaging (EPPD) Division respectively. As such, the two conferences have served for many years as the premier venues for enabling hundreds of engineers to meet, exchange ideas and technical information, and to learn of the latest advances in technology in Heat Transfer and Electronic and Photonic Packaging technical disciplines and industries.

In 2005, these two premier conferences will be co-located in beautiful San Francisco, allowing engineers to expand their technical horizons by facilitating participation in both conferences under one roof. For 2005, the InterPACK Conference has expanded to include the co-sponsorship of ASME's MEMS Division and The Nanotechnology Institute in order to provide a venue for exciting emerging packaging technologies at the Micro- and Nano- scales.

This unprecedented collaboration between four of ASME's major technical divisions, as well as the continuing participation of the JSME and AIChE as co-sponsors, will surely make the co-located 2005 ASME InterPACK Conference and the 2005 Heat Transfer Conference a "MUST" for your 2005 technical calendar!