Heat Transfer Keynote Speakers

Monday, July 18, 2005

8:00AM - 9:00AM* William Holt Vice President and General Manager, Technology and Manufacturing Group Intel Corporation Topic: Moore’s Law, 40 years and Counting; Future Directions of Silicon and Packaging

Tuesday, July 19, 2005

8:00AM - 9:00AM Max Jakob Keynote Vijay Dhir Professor and Dean University of California at Los Angeles Topic: Mechanistics Prediction of Nucleate Boiling Heat Transfer - Achievable or a Hopeles Task?

Wednesday, July 20, 2005

8:00AM - 9:00AM* Brian Spalding Managing Director, CHAM (UK) Imperial College Topic: Solid-Fluid-Thermal Analysis of Heat Exchangers

Thursday, July 21, 2005

11:00AM Kern Lecture Ram Shah Rochester Institute of Technology Topic: Advances in the Science and Technology of Compact Heat Exchangers 2:00PM-2:45PM Bengt Sundén Professor of Heat Transfer and Head Department of Heat and Power Engineering, Lund Institute of Technology, Lund, Sweden Topic: CFD in Design and Development of Heat Exchangers 2:45PM-3:30PM Danesh Tafti Director, High Performance Computational Fluid-Thermal Science and Engineering Lab Virginia Polytechnic Institute and State University Topic: Computational Insights Into Air-Side Flow and Heat Transfer in Compact Heat Exchangers

InterPACK'05 Keynote Speakers

Monday, July 18, 2005

8:00AM - 9:00AM* William Holt Vice President and General Manager, Technology and Manufacturing Group Intel Corporation Topic: Moore’s Law, 40 years and Counting; Future Directions of Silicon and Packaging 1:15PM - 2:00PM Yoshio Nishi Professor of Electrical Engineering and Director of Research, Center for Integrated Systems, Director Stanford Nanofabrication Facility Topic: CMOS Scaling and Nanoelectronics Era

Tuesday, July 19, 2005

8:00AM - 9:00AM Katherine Frase Vice President, Worldwide Packaging and Test IBM Corporation Advances and Challenges in Packaging Technology 1:15PM - 2:00PM Raymond Li Vice President, Central Engineering ATI Technologies Topic: Challenges in the Next Generation of Video Graphic Processors

Wednesday, July 20, 2005

8:00AM - 9:00AM* Brian Spalding Managing Director, CHAM (UK) Imperial College Topic: Solid-Fluid-Thermal Analysis of Heat Exchangers 1:15PM - 2:00PM Hans Stork Senior Vice President, Chief Technology Officer, Director, Silicon Technology Development Texas Instruments Topic: Systems on chip and package; the future of integration

Thursday, July 21, 2005

8:00AM - 9:00AM Juergen Gromer President Tyco Electronics Topic: Passive Electronics, Current and Future Packaging Challenges

Friday, July 22, 2005

8:00AM - 9:00AM Dr. Joy Crisp, JPL Project Scientist for the Mars Exploration Rover JPL Topic: Mars Exploration Rover Science Results

*Joint sponsored plenary session with InterPACK'05 and Heat Transfer Summer Conference