Please note that the following times are dedicated to exhibitors and sponsors.

Monday, July 18, 2005 10:30AM - 11:00AM 3:30PM - 4:00PM	Wednesday, July 20, 2005 7:00AM - 8:00AM 10:30AM - 11:00AM 3:30PM - 4:00PM
Tuesday, July 19, 2005 10:30AM - 11:00AM 3:30PM - 4:00PM	Thursday, July 21, 2005 10:30AM - 11:00AM 3:30PM - 4:00PM

2005 Exhibitor Listing

ASME

Web Site: http://www.asme.org Company Description: Vision To be the premier organization for promoting the art, science and practice of mechanical and multidisciplinary engineering and allied sciences to our diverse communities throughout the world. Mission To promote and enhance the technical competency and professional well being of our members, and through quality programs and activities in mechanical engineering, better enable its practitioners to contribute to the well being of humankind.

Begell House Inc.

Web Site: http://www.begellhouse.com Company Description: Begell House publishes books and journals both in print and on-line, providing the latest research data and information across a broad spectrum of engineering and sciences. With titles in heat and mass transfer, multiphase systems, fluid dynamics, computational chemical and medical sciences and applications, Begell House is your source for timely research data and information in all areas of science, medicine, and technology.

COMSOL, Inc.

Web Site: http://www.comsol.com Company Description: COMSOL is the maker of FEMLAB finite element software used to model applications in all fields of engineering and science. FEMLAB comprises a powerful, unique environment for modeling applications involving: Surface-to-surface (cavity) radiation Non-Isothermal flow Conduction and Convection Highly conductive layer boundary conditions Out-of-plane heat transfer FEMLAB it is used to model coupled systems of nonlinear Partial Differential Equations. All FEMLAB models can be saved as M-files and manipulated in the MATLAB environment if desired. Since it is equation-based, you can define and couple your PDEs freely and arbitrarily – true Multiphysics in 1D, 2D, and 3D.

ESPEC Corporation

Web Site: www.espec-ets.com Company Description: Espec-ETS supplies, SIR/CAF/electrochemical migration testers with humidity chambers, solder crack/solder joint testers with thermal shock chambers (temp. cycling chambers), hot and cold plate, wafer level reliability testers including E.M., TDDB, Low-K/High-K and packaging burn-in ovens.

Fluent

Web Site: www.fluent.com Company Description: For over twenty years Fluent has successfully delivered software products that solve problems in a wide range of industries. The Ice division of Fluent is dedicated to solving problems confronting the electronics industry. We offer a suite of software products, including IcePak, IceBoard, IceChip, and IceMax that simulate thermal/fluid and electrical phenomena within electronics components and systems.

GrafTech International Ltd.

Web Site: http://www.graftech.com

Heat Transfer Research Institute

Web Site: http://www.htri.net

Innovative Research, Inc.

Web Site: http://www.inres.com Company Description: Innovative Research, Inc. will present two software products MacroFlowTM and TileflowTM, that we offer to the electronic cooling industry. MacroFlow is a Flow Network Modeling (FNM software tool featuring an intuitive Graphical Use Interface (GUI), an extensive components library, and a powerful solution methodology for rapid thermal design of air and liquid-cooling systems for computer, telecom, and defense electronics. TileFlow is a Computational Fluid Dynamic (CFD) software tool for efficient analysis of airflow distribution in raised-floor data centers. It is being actively used by equipment manufacturers, consulting engineers, and facility managers for the air-cooling design of practical data centers.

Taylor and Francis

Web Site: http://www.taylorandfrancis.com Company Description: The Taylor & Francis Group, (now incorporating CRC Press), is a premier publisher of scientific books, journals and databases. Please visit our booth to pick up a journal sample copy or to browse our latest book titles at a conference discount of up to 25%.