2005 ASME InterPACK'05 Conference

Conference General Chair
Alfonso Ortega, Ph.D., University of Arizona
Email: ortega@u.arizona.edu

Conference Co-General Chair for Far East
Noriyuki Miyazaki, Ph.D., Kyoto University (Japan)
Email: miyazaki@mech.kyoto-u-ac.jp

Conference Program Chair
Roger R. Schmidt, Ph.D., IBM Corp.
Email: c28rrs@us.ibm.com

Program Chair MEMS
Ryszard Pryputniewicz, Ph.D., Worcester Polytech Institute
Email: rjp@wpi.edu

Program Chair for NEMS
Avram Bar-Cohen, Ph.D., University of Maryland
Email: abc@eng.umd.edu

Co-Sponsors

Institute of Electrical Engineers (IEEE)
The Japan Society of Mechanical Engineers (JSME )

2005 Heat Transfer Summer Conference

Conference General Chair
Russell D. Skocypec, Ph.D., Sandia National Lab
Email: rdskocy@sandia.gov

Conference Program Chair
Cristina H. Amon - Sc.D., Carnegie Mellon University
Email: camon@cmu.edu

ASME HTD Organizing Committee
Heng Ban, J.P. Delplanque, Ahmad Fakheri, Amy Fleischer, S. Mostafa Ghiaasiaan, Matthew Jones, Tien-Chien Jen, Muhammad Rahman, S.A. Sherif, Neil Wright, and Lili Zheng

AIChE Co-sponsorship

AIChE Conference Co-Chair
Joel Plawsky, Ph.D., Rensselaer Polytechnic Institute
Email: plawsky@rpi.edu

AIChE Program Co-Chair
Mohamed El-Genk, Ph.D., University of New Mexico,
Email: mgenk@unm.edu