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The Heat Transfer Division of ASME, in collaboration with the Japan Society of Mechanical Engineers and the American Institute of Chemical Engineers invite you to participate in the upcoming 2005 Heat Transfer Summer Conference, San Francisco, CA, Westin St. Francis Hotel, July 17-22, 2005; Co-located with InterPACK '05, The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.
This international event of academics and industry professionals provides a forum for the exchange of state-of-the-art knowledge in research and application of heat, mass and momentum transfer in all fields of mechanical engineering, chemical engineering, nuclear engineering and related technologies.
Conference Objectives
The Heat Transfer Summer Conference addresses issues facing the automotive, aerospace, chemical, nuclear, biotechnology, electronic and energy markets. The exchange of technical information will occur in areas ranging from energy to electronic systems as well as on research from computational and numerical methods to multi-phase phenomena. View a complete list of topics.
Technical Highlights
Technical information will be presented in unique forums and archived in electronic conference proceedings for future use and reference. This year's conference will provide a forum for exchange of information related to the following areas:
- heat transfer in energy systems
- thermophysical properties
- heat transfer in multiphase systems
- heat transfer in manufacturing and materials processing
- heat transfer in electronic equipment
- low temperature heat transfer
Network with the Who's Who of Heat Transfer
The conference gathers academics and industry professionals from all over the world to exchange information and establish business contacts. The compositions of our attendees come from many technical interests and various job functions, including those persons from micro- and nano-technology disciplines. Past attendees have included:
- 25% from industry and government R&D
- 75% come from research and development
- 58% from the USA community
- 42% are from the International community
This unprecedented collaboration between four of ASME's major technical divisions, as well as the continuing participation of the JSME and AIChE as co-sponsors, will surely make the co-located 2005 Heat Transfer Conference and InterPACK '05 Conference a MUST for your 2005 technical calendar!
International AttendeesFor additional information regarding visas and letters of invitation, please view the travel information.
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Available from ASME Press...