Department of Mechanical Engineering and Materials Science
Materials Science,Yokohama National University

Short Biography

1966 Graduated from Dept. of Precision Machinery Engineering, University of Tokyo, Bachelor of Engng.
1971 Finished postgraduate course, Dept. of Precision Machinery Engng., University of Tokyo, Dr. of Engng.
1971 Lecturer of Yokohama National Univ.
1972 Associate Professor of Y.N.U.
1984 Professor of Y.N.U.
JSME Computational Mechanics Award (1997)
ASME International EEPD Award (1997)

Editorial / Paper Review Experience

(1) ASME PVP Vol.173, "Weld Residual Stresses and Plastic Deformation” (1989)
(2) ASME PVP Vol.175, "Design and Analysis of Pressure Vessels and Components" (1989)
(3) JSME CMD, "Computational Mechanics for Electronic Devices / Components", ISAC '94 (1994)
(4) ASME PVP Vol.305, "Current Topics in Computational Mechanics", (1995)
(5) ASME EEP Vol.19-1&2, "Advances in Electronic Packaging 1997", (1997)

Journal Publications

1)M.Shiratori,Q.Yu. and A.Nishijima,"Analysis of Stress Intensity Factors and Probabilistic Fatigue Life Assessment for Surface Cracks in Flip Chip Solder Joints",ASME, in Proc. Advances in Electronic Packaging, EEP-Vol. 4-1,487-492,(1993).

2)M. Shiratori,Q.Yu.,Y.Takahashi and N.Ogasawara,"Detection of Flaws in Honeycomb Sandwich Constructions by Infrared Thermography", Conference on Advanced Technology in Experimental Mechanic '93,83-88,(1993.7).

3)Q.Yu.,M.Shiratori. and Wang,S.B,"Stress Analysis of Surface-Mount Assembly by an Influence Function Method", ASME in Proc. Advances in Electronic Packaging,EEP-Vol.4-1,227-232,(1993.9).

4)Q.Yu.,M.Shiratori. and T. Mori,"Nonsteady Thermal Stress Analysis and Thermal Fatigue Strength of Metal-CFRP Bonded Joints",JSME International Journal Series A,36-1,43-49,(1993.9).

5)M.Shiratori,Q.Yu.,Y.Takahashi and N.Ogasawara, "Application of Infrared Thermography to Detection of Flaws in Honeycomb Sandwich Constructions ",JSME International Journal Series A,37-4,396-402,(1994).

6)M.Shiratori,Y.Takahashi and Q.Yu.,"Application of Infrared Thermography to Detection of Cracks", JSME International Journal,Series A,37-3,296-302,(1994).

7)M.Shiratori. and Q.Yu., "A Benchmark Test of Computational Mechanics in Electronic Devices/Components",ASME,WAM'94,AMD-vol.187,Mechanics and Materials for Electronic Packaging,2,63-72,(1994.11).

8)Q.Yu.,M.Shiratori and Wang.S.B, "Thermal Conduction and Thermal Stress Analysis of Surface-Mount Assembly with a Solder Joint Element ", ASME,WAM'94,AMD-Vol.187,Mechanicals and Materials for Electronic Packaging,2,205-211,(1994.11).

9)M.Shiratori,Q.Yu. and Wang and S.B, "A Computational and Experimental Hybrid Approach to Creep-Fatigue Behavior of Surface-Mounted Solder Joints " ,ASME, in Proc. Advances in Electronic Packaging,EEP-Vol.10-1,451-457,(1995).

10)Q.Yu. and M.Shiratori, "A Study of Mechanical and Thermal Stress Behavior due to Global and Local Thermal Mismatch of Dissimilar Materials in Electronic Packaging " ,ASME in Proc. Advances in Electronic Packaging,EEP-Vol.10-1,389-394,(1995.3).

11)M.Shiratori,Q.Yu.,A.Nishijima and K.Watanabe, "Analysis of Stress Intensity Factors for Surface Cracks in Thermal Stress Field ", PVP-Vol.305,379-385,(1995.3).

12)N.Ogasawara,M.Shiratori,S.Miyahara,Q.Yu. and A. Miyano, "Modeling analyses of a Honeycomb Sandwich Construction",Computational Mechanics '95,2,2365-2370,(1995.7).

13)Q.Yu. and M.Shiratori,"A Finite Element and Experimental Study to Creep-Fatigue Behavior of Microelectronics Solder Joints",ASME WAM'95,95WA/EEP-9.

14)M.Shiratori and Q.Yu.,"Fatigue-Strength Prediction of Microelectronics Solder Joints under Thermal Cyclic Loading",Fifth Inter society Conference on Thermal Phenomena in Electronic Systems,151-157,(1996.5).

15)M.Shiratori. and Q.Yu.,"Life Assessment of Solder Joint Advances in Electronic Packaging",ASME, EEP-Vol. 19-2,1471-1477,(1997).

16) M.Koishi.,M.Shiratori,T.Miyoshi and K.Kabe,"Homogenization Method for Dynamic Viscoelastic Analysis of Composite Materials",JSME International Journal, Series A,3-40, 306-312,(1997).

17)Q.Yu. and M.Shiratori,"Fatigue-Strength Prediction ofMicro-electronics Solder Joints Under Thermal Cyclic Loading",IEEE Trans. Comp.,Hybrids,Manufact. Technol.,2-20,266-273,(1997).

18) N.Ogasawara. and M.Shiratori,"Application of Infrared Thermography to Fracture mechanics",Proceedings of Thermosense XIX,201-212,(1997.4).

19)Q.Yu.,M.Shiratori and N Kojima.,"Fatigue Crack Propagating Evaluation of Microelectronics Solder Joints",Advances in Electronic Packaging,ASME,EEP-Vol. 19-2,1445-1450,(1997.6).

20)Q.Yu.,T. Kashiwamura,M.Shiratori and K. Satoh,"Reliability and Structure Optimization of BGA Packages",Advances in Electronic Packagingv ASME, EEP-Vol. 19-2, 1761-1767,(1997.6).

21)Y. Kaga,S.Zama,Q.Yu.,M.Shiratori and K.Sato,"New Stud Bumping Technology Using Copper Wire",Proceedings of Surface Mount International Advanced Electronics Manufacturing Technologies,273-277,(1997.9).

Activities in Academic Societies

1) Excecutive Board Member of JSME, Japan Society of Mechanical Engineers (1992, 1997).

2) Excecutive Board Member of JSCES, Japan Society of Computational Engineering and Science (1995).

3) Excecutive Board Member of JIEP, Japan Institute of Electronic Packaging (1996?.

4) Excecutive Board Member of ASME EEPD, Electronic and Electronic Packaging Division, American Society of Mechanical Engineers (1998?).