Avram Bar Cohen is Distinguished University Professor and Chair of Mechanical Engineering at the University of Maryland, where he continues his research in the thermal management of Micro/Nano systems. Bar-Cohen is the General Chair of the upcoming International Heat Transfer Conference in 2010, the Editor-in-Chief of Transactions for the IEEE CPMT Society and a member of its Board of Governors, co-author (with A.D. Kraus) of "Design and Analysis of Heat Sinks" (1995) and "Thermal Analysis and Control of Electronic Equipment" (1983), and has co-edited 13 books in this field. Bar-Cohen also serves as a co-editor for the Elsevier book series, Advances in Heat Transfer He has authored and co-authored some 300 Journal papers, Refereed Proceedings papers, and Chapters in books, and has delivered more than 60 Keynote, Plenary, and Invited Lectures at major technical Conferences and Institutions. Bar-Cohen has advised to completion 54 PhD and MS students, at the University of Maryland, University of Minnesota, and the Ben Gurion University (in Israel).

In July 2007 Bar-Cohen received the ASME InterPack Achievement Award for “his long term and continued contributions in the field of Electronic and Photonic packaging.” This followed the 2002 IEEE CPMT Society, Outstanding Sustained Technical Contributions Award, “for contributions to thermal design, modeling, and analysis and for original research on ebullient and liquid-phase cooling,” and the 2000 ASME Worcester Reed Warner Medal, “for outstanding contributions to the literature in the area of heat transfer.” He was earlier recognized with the ASME Heat Transfer Memorial Award and the ASME Curriculum Innovation Award in 1999 (with S. Bhavnani and Y. Joshi), the ASME/IEEE ITHERM Achievement Award in 1998, ASME Edwin F. Church Medal in 1994, and the THERMI Award from the IEEE/Semi-Therm Conference in 1997. He is a Fellow of the ASME and of IEEE, a distinguished Lecturer for IEEE, was the Founding Chairman of the IEEE ITHERM Conference in 1988, and served as the General Chairman for ASME’s first InterPack Conference in 1995.

Higher Education:
Ph.D., Massachusetts Institute of Technology, 1971
S.M., Massachusetts Institute of Technology, 1968
S.M. Massachusetts Institute of Technology, 1968

Honors received – awards, citations, etc. Please include sources and dates:

-1983 ASME Fellow;
-1992 ASME Dedicated Service Award "…for his work in Professional Development;"
-1993 IEEE Fellow
-1994 ASME Edwin F. Church Medal, "In recognition of contributions to engineering education, continuing education and professional development on both the national and international levels;"
- 1994 ASME Electronic and Electrical Packaging Division, Outstanding Contribution Award "For outstanding contributions to application of Heat Transfer Science to Electronic Packaging;"
- 1994-1997 ASME Distinguished Lecturer;
- 1997 IEEE/Semi-Therm THERMI Significant Contributor Award "For his many contributions to the thermal management of semiconductors;"
- 1998 ASME/IEEE ITHERM Memorial Award "For significant contributions to the field of thermal and thermomechanical engineering for electronics packaging;"
- 1999 ASME Heat Transfer Memorial Award "For work contributing to a greater understanding of immersion cooling, pool boiling of dielectric fluids, and other aspects of electronics cooling;"
- 1999 ASME Curriculum Innovation Award, Board on Engineering Education, for "The Classroom of the Future: An Internet-Delivered National Course on Thermal Management of Electronics," (with S. Bhavnani and Y. Joshi); - 2000 ASME Worcester Reed Warner Medal, "..for outstanding contributions to the literature in the area of heat transfer, including more than 180 technical papers, and pioneering research and experimentation in electronic cooling and natural convection;"
- 2000 IEEE Distinguished Lecturer;
- 2002 IEEE CPMT Society, Outstanding Sustained Technical Contributions Award, "for contributions to thermal design, modeling, and analysis and for original research on ebullient and liquid-phase cooling".
- 2005 University of Maryland, Distinguished University Professor
- 2007 ASME InterPack Achievement Award for “his long term and continued contributions in the filed of Electronic and Photonic Packaging.”