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Conference Co-Chairs
Gang Chen
Massachusetts Institute of Technology
gchen2@mit.edu
Ricky Lee
The Hong Kong University of Science and Technology
rickylee@ust.hk
Steven Walsh
MANCEF/University of New Mexico
swalsh91@comcast.net
Robert Warrington
Michigan Technological University
row@mtu.edu
Zhuomin Zhang
Georgia Institute of Technology
zhuomin.zhang@me.gatech.edu
International Advisory Committee
- Yia-Chung Chang, Research Center for Applied Sciences, Academia Sinica, Taiwan
- Kenneth Goodson, Stanford University, USA
- Jean-Jacque Greffet, Ecole Centrale Paris, France
- Costas P. Grigoropoulos, UC Berkeley, USA
- Zeng-Yuan Guo, Tsinghua University, China
- Chih-Ming Ho, UCLA, USA
- Joon-Sik Lee, Seoul National University, Korea
- Arun Majumdar, UC Berkeley, USA
- Patrick Phelan, National Science Foundation, USA
- G.P. (Bud) Peterson, University of Colorado - Boulder, USA
- Dimos Poulikakos, ETH Zurich, Switzerland
- Liding Wang, Dalian University of Technology, China
- Z.-L. Wang, Georgia Institute of Technology, USA
- Sishen Xie, Chinese Academy of Science, China
- Xianfan Xu, Purdue University, USA
Technical Program Committee
- Yu-bin Chen, National Cheng Kung University, Taiwan
- Ping Cheng, Shanghai Jiao Tong University, China
- Victor A. Chiriac, Freescale Semiconductor, Inc., USA
- Levent Degertekin, Georgia Institute of Technology, USA
- Z. Hugh Fan, University of Florida, USA
- Nicholas X. Fang, University of Illinois at Urbana-Champaign, USA
- Peter Hesketh, Georgia Institute of Technology, USA
- Tony Jun Huang, Pennsylvania State University, USA
- Yi-Kuen Lee, Hong Kong University of Science and Technology, China
- Wen J. Li, Chinese University of Hong Kong, China
- Wei Lu, EECS, University of Michigan, USA
- Navin Manjooran, Siemans AG, USA
- Shigeo Maruyama, University of Tokyo, Japan
- M. Pinar Menguc, University of Kentucky, USA
- Sushanta K. Mitra, IIT Bombay, India
- Seungho Park, Hongik University, Korea
- Jud Ready, Georgia Tech Research Institute, USA
- Sebastian Volz, CNRS, France
- Xinwei Wang, University of Nebraska - Lincoln, USA
- Charles Chun Yang, Nanyang Technological University, Singapore
- Ronggui Yang, University of Colorado - Boulder, USA
- Alice Haixia Zhang, Institute of Microelectronics, Peking University, China
- Min Zou, University of Arkansas, USA
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