IPACK2005-73014  

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

IPACK2005-73020  

Development of Integrated Process-ageing Modeling Methodology for Flip Chip on Flex Interconnections with Non-conductive Adhesives

IPACK2005-73045  

Solder Joint Reliability Improvement Using the Cold Ball Pull Metrology

IPACK2005-73062  

Simulation of Warpage Considering Both Thermal and Cure Induced Shrinkage During Molding in IC Packaging

IPACK2005-73079  

Novel cyanide free electroless Au plating for the reliable joint between Ni-P/Au and Sn-Ag-Cu based lead free solder

IPACK2005-73161  

The Bondabilities of Various Metals Using AG Metallo-Organic Nanoparticles and These Bonding Mechanisms

IPACK2005-73164  

The sintering process of Ag metallo-organic nanoparticles and the influence of the joining parameters upon Cu-to-Cu joining

IPACK2005-73167  

Effects of Interfacial Microstructure on Strength of Solder Joint using Sn-Ag-Bi-In Solder

IPACK2005-73209  

Characterization of Thermal Stress Phenomena Induced Into a Packaged Planar Lightwave Circuit Using Fiber Bragg Grating Sensors

IPACK2005-73249  

Structural Analysis of Microelectronic and Photonic Packaging Systems

IPACK2005-73253  

Wafer Level Package Challenges: Fabrication Methodology, Packaging Infrastructure and Die-Shrink Considerations

IPACK2005-73257  

Deformation and Fatigue Fracture of Pb-free Solder Alloys Under Complicated Load Conditions

IPACK2005-73296  

Novel Test Methods for Die Strength

IPACK2005-73299  

Fabrication of Sub-micron Silicon Vias by Deep Reactive Ion Etching

IPACK2005-73301  

Use of Array Capacitors to Improve the Power Delivery Performance of a Microprocessor System

IPACK2005-73304  

Mechanical Modeling of a Solder Thermal Interface Material: Implications for Thermo-Mechanical Reliability

IPACK2005-73306  

On Measurement of Effective Silicon Backend Strength Using Bump Pull/Shear Techniques

IPACK2005-73320  

An Overview of System in Package (SiP) Applications and Technologies for CPU and Communications Systems

IPACK2005-73321  

HP’s mx2 Processor Module: Twice the Processors in Half the Volume

IPACK2005-73328  

Analytical and Experimental Characterization of Bonding Over Active Circuitry

IPACK2005-73329  

Chip Scale Package for Image Sensor Device

IPACK2005-73339  

Electrical simulation design technology of silicon through substrate

IPACK2005-73360  

Mechanical Design and Analysis of Land Grid Array (LGA) Sockets

IPACK2005-73362  

Thermal-Fatigue Life Prediction Equations for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints

IPACK2005-73364  

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

IPACK2005-73371  

A Paradigm Shift in the Development of Chemical Mechanical Polishing (CMP): Cost-Effective CMP Planarization in Next Generation Substrate/Package Design and Manufacturing

IPACK2005-73391  

Dual Die Package Design Strategy and Performance

IPACK2005-73484  

Characterization of Fine Pitch CSP Solder Joints Under Board-Level Free Fall Drop (BFFD)