ASME InterPACK '05

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Conference Schedule	Program Overview \| Program Search

Monday, July 18, 2005

09:00 AM to 10:30 AM

1-1	Advanced Packaging (Technical)	No.of Papers: 6
5-2	Novel/Alternative Electronics Cooling Concepts/Technologies (Technical)	No.of Papers: 5
9-1	Experimental Techniques and Modeling in Electronic and Photonic Systems (Technical)	No.of Papers: 5
10-1	MEMS Test and Measurement (Technical)	No.of Papers: 6
14-1	Micro and Nanofabrication Processes - part 1 (Technical)	No.of Papers: 4

11:00 AM to 12:30 PM

5-3	Micro-Scale Heat Transfer in Electronics I (Technical)	No.of Papers: 6
8-1	Optical MEMS I (Technical)	No.of Papers: 5
9-2	Solder Joint Reliability (Technical)	No.of Papers: 5
19-1	Airborne, Space & Defense Electronics Packaging (Technical)	No.of Papers: 4
20-1	Biosensors/Bioengineering (Technical)	No.of Papers: 4

02:00 PM to 03:30 PM

1-2	Interconnections & Substrates (Technical)	No.of Papers: 4
5-4	Thermal Modeling of Electronic Systems I (Technical)	No.of Papers: 5
5-16	Micro-Scale Heat Transfer in Electronics II (Technical)	No.of Papers: 4
8-2	Optical MEMS II (Technical)	No.of Papers: 4
14-2	Micro - and Nanofabrication Processes - Part 2 (Technical)	No.of Papers: 4

Tuesday, July 19, 2005

09:00 AM to 10:30 AM

2-1	Packaging for Micro/Nanosystems (Technical)	No.of Papers: 4
3-1	Die and Die Interconnect Stress Characterization (Technical)	No.of Papers: 5
5-5	Heat Sink Modeling and Characterization I (Technical)	No.of Papers: 5
10-2	MEMS Characterization (Technical)	No.of Papers: 5
11-1	Manufacturing and Test of Electronic Systems (Technical)	No.of Papers: 3

11:00 AM to 12:30 PM

1-3	Design & Optimization (Technical)	No.of Papers: 4
3-2	Process Induced Delamination and Warpage (Technical)	No.of Papers: 6
5-6	Thermal Challenges for the Next Generation of PC Equipment (Technical)	No.of Papers: 5
9-4	Application of Thermomechanical Modeling and Characterization in Microelectronics (Technical)	No.of Papers: 5
10-3	MEMS Design (Technical)	No.of Papers: 6

02:00 PM to 03:30 PM

1-4	Lead-free Soldering (Technical)	No.of Papers: 4
3-3	Mechanical Characterization of Lead Free Solders (Technical)	No.of Papers: 5
4-1	Reliability of Micro/Nanosystems (Technical)	No.of Papers: 6
5-14	Cooling Technologies for High Heat Flux Applications (Technical)	No.of Papers: 5
6-1	Characterization and Modeling of Small Scale Thermofluids (Technical)	No.of Papers: 6
9-5	Application of Heat Transfer and Flow Modeling in Electronic Packages and Systems (Technical)	No.of Papers: 5

Wednesday, July 20, 2005

09:00 AM to 10:30 AM

1-5	Structural & Stress Analysis (Technical)	No.of Papers: 5
3-4	Electromigration and Current Stressing (Technical)	No.of Papers: 5
5-8	Thermal Interface Materials or Spreaders I (Technical)	No.of Papers: 5
9-6	Reliability of Electronic Packages and Systems Under Environmental Conditions (Technical)	No.of Papers: 3
21-1	Microfluidics (Technical)	No.of Papers: 6

11:00 AM to 12:30 PM

1-6	Experimental Investigation (Technical)	No.of Papers: 5
5-9	Data Center Thermal Management I (Technical)	No.of Papers: 5
5-10	Thermal Modeling of Electronic Systems II (Technical)	No.of Papers: 5
5-19	Thermal Interface Materials or Spreaders II (Technical)	No.of Papers: 5
23-1	RF MEMS Packaging and Integration - I (Technical)	No.of Papers: 6

02:00 PM to 03:30 PM

3-6	Analysis and Characterization of Solders and Platings (Technical)	No.of Papers: 5
5-17	Thermal Modeling of Electronic Systems III (Technical)	No.of Papers: 6
5-20	Data Center Thermal Management II (Technical)	No.of Papers: 5
9-7	Reliability of Electronic Packages and Systems Under Dynamic Conditions (Technical)	No.of Papers: 4
23-2	RF MEMS Packaging and Integration - II (Technical)	No.of Papers: 3

Thursday, July 21, 2005

09:00 AM to 10:30 AM

5-11	Liquid Cooling of Electronic Systems (Technical)	No.of Papers: 5
9-8	Electrical Modeling and Characterization (Technical)	No.of Papers: 4
13-1	Materials, Processes and Technologies 1 (Technical)	No.of Papers: 4
18-1	Electrical Design, Modeling, and Simulation (Technical)	No.of Papers: 4
25-1	Solid State Refrigeration and Power Generation - Applications I (Technical)	No.of Papers: 4

11:00 AM to 12:30 PM

3-5	Numerical Simulation of Package Reliability (Technical)	No.of Papers: 6
5-12	Low Temperature (Refrigeration) Cooling Technologies (Technical)	No.of Papers: 3
13-2	Materials, Processes and Technologies 2 (Technical)	No.of Papers: 4
17-1	Microwave Wave Design and Analysis (Technical)	No.of Papers: 5
18-2	Materials, Processing, and Characterization (Technical)	No.of Papers: 4
24-1	Electro-thermal Interactions (Technical)	No.of Papers: 5

02:00 PM to 03:30 PM

5-13	Heat Sink Modeling and Characterization II (Technical)	No.of Papers: 5
13-3	Materials, Processes and Technologies 3 (Technical)	No.of Papers: 6
25-2	Solid State Refrigeration and Power Generation - Applications II (Technical)	No.of Papers: 5

Friday, July 22, 2005

09:00 AM to 10:30 AM

3-7	Shock, Drop, and Vibration Reliability I (Technical)	No.of Papers: 5
5-7	Heat Pipes/Thermosyphons for Electronics Cooling I (Technical)	No.of Papers: 4
13-4	Materials, Processes and Technologies 4 (Technical)	No.of Papers: 5
25-3	Solid State Refrigeration and Power Generation - Fundamentals (Technical)	No.of Papers: 5

11:00 AM to 12:30 PM

3-8	Shock, Drop, and Vibration Reliability II (Technical)	No.of Papers: 4
5-15	Convection Cooling in Electronic Equipment (Technical)	No.of Papers: 4
5-18	Heat Pipes / Thermosyphons for Electronics Cooling II (Technical)	No.of Papers: 5
13-5	Materials, Processes and Technologies 5 (Technical)	No.of Papers: 4

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