The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems is an International Forum for Exchange of State-of-the-Art Knowledge in Research, Development, Manufacturing, and Application in the Integration and Packaging of MEMS, NEMS, and Electronic Systems.

Sponsored by ASME with the participation of The Institute of Electrical & Electronic Engineers (IEEE) & The Japan Society of Mechanical Engineers (JSME).

Conference Objectives
The InterPACK Conference aims to promote international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave, MEMS and NEMS- Systems Packaging and Integration. Emerging knowledge, research results, new developments, and novel thermal/mechanical/electrical/materials packaging product concepts in Electronic Packaging Engineering will be presented in unique forums and archived in electronic conference proceedings.

Conference Planning Committee Members
General Chair: Prof. Alfonso Ortega, The University of Arizona (USA)
Co-General Chair for Far East: Prof. Noriyuki Miyazaki, Kyoto University (Japan)
Conference Program Chair: Dr. Roger Schmidt, IBM Corporation (USA)
Conference Program Co-Chair for MEMS: Prof. Ryszard J. Pryputniewicz, WPI (USA)
Conference Program Co-Chair for NEMS: Prof. Avram Bar-Cohen, The University of Maryland (USA)
Advisory Committee: President Hiroyuki Abe, Tohoku University, Japan; Prof. Dereje Agonafer, Univ. of Texas-Arlington; Prof. Avram Bar-Cohen, University of Maryland; Dr. William T. Chen, National University of Singapore; Prof. Motoo Fujii, Kyushu University, Japan; Prof. Y.C. Lee, Univ. of Colorado; Prof. Wataru Nakayama, Japan; Dr. Donald Price, Raytheon; Prof. Masumi Saka, Tohoku University, Japan; Prof. Masaki Shiratori, Yokohama National University, Japan; Dr. Ephraim Suhir, University of California, Santa Cruz
International Liaisons: Prof. Carlos Altemani (Brazil); Prof. Adam Skorek (Canada); Prof. Yuqin Gu and Prof. Ricky S. W. Lee (China); Dr. Bernard Courtois (France); Dr. Rolf Aschenbrenner (Germany); Prof. Soon-Bok Lee and Prof. Kyung W. Paik (Korea); Prof. Andrew A. 0. Tay and Prof. John Pang (Singapore); Prof. Andrew Y. H. Hung (Taiwan); Dr. David Whalley (United Kingdom); Dr. Johan Liu (Sweden); Dr. Gordana Popovic (Austria); Dr. Josef Brossner (Austria)

• Track 1 Packaging of Electronic and Photonic Systems
• Track 2 Packaging for Micro/Nanosystems
• Track 3 Reliability of Electronic and Photonic Systems
• Track 4 Reliability of Micro/Nanosystems
• Track 5 Thermal Management of Electronic and Photonic Systems
• Track 6 Thermal Management of Micro/Nanosystems
• Track 8 Optical MEMS
• Track 9 Modeling and Characterization of Electronic and Photonic Systems
• Track 10 Testing and Characterization of MEMS
• Track 11 Manufacturing and Test of Electronic and Photonic Systems
• Track 13 Materials, Processes, and Technologies
• Track 14 Micro- and Nanofabrication Processes
• Track 17 RF Micowave
• Track 18 Embedded Passives
• Track 19 Airborne, Space & Defence Electronic Packaging
• Track 20 Biosensors/Bioengineering
• Track 21 Microfluidics
• Track 23 RF MEMS
• Track 24 Electro-thermal Interactions
• Track 25 Solid State Power Generation and Refrigeration for Electronic Packages and Systems

Submit an abstract to IPACK2005.

Publication Schedule
If you are planning to submit an abstract for consideration for IPACK2005 please note the following deadlines. When your abstract is submitted, you will receive a confirmation and an assigned paper number. Late submissions may not be accepted.

Submission of Abstract: December 3, 2004
Submission of Full-Length Draft Paper for Review: March 4, 2005
Submission of Final Paper: May 13, 2005

Please note the following:

• Publication is not guaranteed for final manuscripts, 1903 forms and hard copies received after May 13, 2005.
• To be included in the published proceedings, at least one author or presenter of a paper must register for the conference and pay all appropriate fees.
• NOTE: ASME is available to assist authors with any Visa requirements to allow them to participate in this conference.

For more information, view the full publication schedule. Deadlines are subject to change.