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ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013)

July 16-18, 2013
Hyatt Regency San Francisco Airport Hotel

1333 Bayshore Hwy
Burlingame, CA 94010

Conference Description
InterPACK'13 is an international forum for exchange of state-of-the art knowledge in research, development, manufacturing, and application on the packaging and integration of Electronic and Photonic Microsystems. This conference will be the 12th in the InterPACK series that began in 1993. It is the flagship technical meeting of the ASME Electronic and Photonic Packaging Division (EPPD) with the participation of the Japanese Society of Mechanical Engineering (JSME).

InterPACK supports EPPD's mission to (a) promote the art, science, and practice of electrical, electronic, and photonics packaging; (b) encourage and foster research, development, and dissemination of reliable data and results of engineering importance pertaining to subjects within the division's scope of activities; (c) encourage the interchange of ideas among engineers by encouraging the preparation and publication of papers in the field of electrical, electronic, and photonics packaging; and (d) encourage the organization of programs for the presentation and discussion of papers where all members of the Society may meet on an equal basis to exchange experiences and technical data. InterPACK also strives to encourage new membership by fostering graduate student participation and encouraging them to join ASME and EPPD.

InterPACK also supports ASME's mission to serve diverse global communities by co-sponsoring the event with JSME. In addition to Japan, the conference attracts other participants from eastern Asia: South Korea, China, Taiwan, and Singapore to name a few. We also have participation from Europe and from the Middle East.

As part of the peer-review process, and further review by the conference leadership, the highest quality papers in the conference are recommended for publication in the Journal of Electronic Packaging (JEP).

Conference Topics

Onsite Registration Hours
Monday, July 15 3:00pm-6:00pm
Tuesday, July 16 7:00am- 6:00pm
Wednesday, July 17 7:00am- 5:00pm
Thursday, July 18 7:00am- 12:30pm

Sponsored By Media Sponsor
ASME - Engineering Around the Globe
Mechanical Engineering Magazine
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