InterPACK'11 is an international forum for exchange of state-of-the art knowledge in research, development, manufacturing, and application on the packaging and integration of Electronic and Photonic Systems, MEMS, and NEMS. This conference will be the 11th in the InterPACK series that began in 1993. It is the flagship technical meeting of the ASME Electronic and Photonic Packaging Division (EPPD), with the participation of JSME, IEEE-CPMT, and iNEMI. Plenary and Keynote Speakers Announced   Plenary Speaker: Thomas W. Peterson National Science Foundation     Keynote Speaker: Ho-Ming Tong ASE Group     Achievement Award Speaker: Yogendra Joshi Georgia Institute of Technology Make Your Hotel Reservations Now! To obtain the ASME group rate of $109, you must make your hotel reservation as soon as possible. Reserve your room online By Phone, Call: 1-800-266-9432 and mention "ASME"

ALL AUTHORS MUST REGISTER!

• At least 1 author from every paper must register by May 23rd.
• Any papers left without an associated registration will be pulled from the conference proceedings.
• Additionally, ALL papers must be presented on site in Portland, OR. Any paper that is NOT presented on-site will be removed from the official archival proceedings!!