Please click on a track below for more information.

• Track 1 Advanced Packaging (AP)
• Track 2 Electro-Thermal-Mechanical Issues in Packaging (Multi-Physics) (EL)
• Track 4 Manufacturing and Test (MT)
• Track 5 Materials and Processes (MP)
• Track 6 MEMS and MEMS Packaging (MM)
• Track 7 Modeling and Simulation (MS)
• Track 8 Nanotechnology and NEMS (NN)
• Track 9 Photonics and Optics (PO)
• Track 10 Reliability (RE)
• Track 11 Thermal Management (TM-I) - Component Level Thermal Management
• Track 12 Thermal Management (TM-II) - System Level Thermal Management
• Track 13 Panel Discussions and Keynotes
• Track 14 Student Poster Competition