InterPACK'09 - The ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS

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General Chair: Prof. Jeffrey C. Suhling, Auburn University (USA)
Co-General Chair Far East: Prof. Masaru Ishizuka, Toyama Prefectural University (Japan)
Conference Program Chair: Dr. Sandeep Tonapi, Anveshak Solutions (USA)

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