Available from ASME Press... Technical Writing A-Z: A Commonsense Guide to Engineering Reports and Theses

InterPACK '09 is an international forum for exchange of state-of-the art knowledge in research, development, manufacturing, and application on the packaging and integration of Electronic and Photonic Systems, MEMS, and NEMS. This conference will be the 10th in the InterPACK series that began in 1993. It is the flagship technical meeting of the ASME Electronic and Photonic Packaging Division (EPPD), with the participation of JSME, IEEE-CPMT, and iNEMI. The conference will feature an impressive program with 80 sessions containing over 390 total presentations; including 300 technical paper presentations, 60 student posters, 4 panels with 16 distinguished panelists, 6 keynote addresses, and 16 tutorial shortcourses. The technical papers will focus on all areas of packaging and integration of microelectronic and photonic systems, MEMS, and NEMS; and are organized within 11 Technical Tracks:

• Track 1 Advanced Packaging (AP)
• Track 2 Electro-Thermal-Mechanical Issues in Packaging (Multi-Physics) (EL)
• Track 4 Manufacturing and Test (MT)
• Track 5 Materials and Processes (MP)
• Track 6 MEMS and MEMS Packaging (MM)
• Track 7 Modeling and Simulation (MS)
• Track 8 Nanotechnology and NEMS (NN)
• Track 9 Photonics and Optics (PO)
• Track 10 Reliability (RE)
• Track 11 Thermal Management (TM-I) - Component Level Thermal Management
• Track 12 Thermal Management (TM-II) - System Level Thermal Management
• Track 13 Panel Discussions and Keynotes
• Track 14 Student Poster Competition

InterPACK '09 is co-located with the ASME Summer Heat Transfer Conference and the ASME 3rd International Conference on Energy Sustainability. All together, the three events feature 875 papers. Your registration fee covers admission to all three conferences, DVD with conference proceedings, conference meals and receptions, and coffee breaks. The 16 tutorial shortcourses are being held on Sunday, July 19, 2009, with free admission to all registrants. Professional Engineers will also be able to earn Professional Development Hours (PDH).