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Publication Schedule

Draft Paper Submission
Deadline: January 15, 2010
Extended to February 1, 2010


See the full publication schedule!

 
 
 
Available from ASME Press...
Technical Writing A-Z: A Commonsense Guide to Engineering Reports and Theses
 
 

Introducing the New ASME Electronic Copyright Process

ASME is implementing a new electronic process for copyright submission effective immediately. This new process gives each author the ability to sign his or her copyright form electronically instead of filling out and sending the paper form to ASME.


In order for your form to be processed correctly, a few procedures need to be followed:


  • At abstract submission, the corresponding author must enter all co-author information in the Tool with complete and verifiable information, including email address and telephone. Non-verifiable contact information may prevent you from completing the copyright form and your paper from being published.

  • Once a draft paper has been accepted for publication, the author will not be able to change the author lineup or paper title.

  • Once a draft paper is accepted for publication, each author of the paper will receive an email message with a unique link that will take each individual author to a website to electronically sign the form.

The entire process should take you 30 seconds or less to complete.


For more detailed information, please go to ASME Copyright Guidelines to familiarize yourself with this new process.


Should you have any questions about the new process or about adding your co-authors, either now or once the process has started, please contact us at copyright@asme.org.



Following the successful proposal by the North American heat transfer community, the 14th International Heat Transfer Conference (IHTC) will be coming to Washington D.C. from August 7-13 in 2010 and headquartered at the Omni Shoreham Hotel. The conference, overseen by the Assembly for International Heat Transfer Conferences (AIHTC), which represents some 25 professional engineering societies active worldwide in thermal science and engineering, has not been held in the United States since the highly successful IHTC of 1986 in San Francisco.


With over 260 international associations, 750 multi-national corporations, 20 million visitors a each year, 3 international airports, and 10 major universities, Washington D.C. is the perfect city to host this event. Historically, the conference has taken place in the following cities:


  • 1990- Jerusalem, Israel (650 attendees)
  • 1994- Brighton, England (930 attendees)
  • 1998- Kyong Ju, Korea (750 attendees)
  • 2002- Grenoble, France (820 attendees)
  • 2006- Sydney, Australia (836 attendees)


The 14th IHTC aims to provide a technical forum that includes keynote lectures, poster sessions, professional development courses, and a live exhibit of heat transfer equipment, services, and publications. In addition to the fundamentals of thermal phenomena and traditional thermal applications, the 14th IHTC is expected to address the emerging domains of thermal transport in nano-materials, bio-systems, Power Generation, MEMS, Microsystems, information systems, energy conversion devices, aerospace and hostile environment systems.


Nominations for Panel and Open Forum sessions are currently being accepted. Send the Panel/Open Forum title, organizer name, and a short description to Professor Avi Bar-Cohen (abc@umd.edu).

Sponsored By Media Sponsor
Supporting Society
American Nuclear Society (ANS)
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