Home
Technical Program
Author Center
Meeting Information
Help
Login
 

Registration
Program Overview
Final Program
Technical Tracks
Publication Schedule
Plenary/Keynote Speakers
Venue/Hotel
Exhibitors/Sponsors
NSF Student Scholarships
Organizers

Contact Us

Technical program
Prof. Satish G Kandlikar

Local conference organizer
Prof. Mark Davies

Local arrangements
Fionnuala O'Connell

Sponsors/exhibitors
Raj Manchanda

Copyright forms
copyright@asme.org

Website support
toolboxhelp@asme.org

 
Organizers

To contact a conference Organizer, click on the appropriate tab.


 

Chairs/Committees

 

Organizers by Track

 

Organizers by Session

 

Staff Support


Conference Chairs
Satish G. Kandlikar, Rochester Institute of Technology, Rochester, NY, USA
Mark Davies, University of Limerick, Ireland


Conference Co-Chairs
Gian Piero Celata, Italy
Xin-Gang Liang, Tsinghua University, China
S. Nishio, Japan
Peter Stephan, Germany
Bernard Thonon, France


Scientific Committee Members
Belgium
Oleg A. Kabov, Universite Libre de Bruxelles


Canada
Masahiro Kawaji, University of Toronto, Toronto, Ontario
I. Hassan, Concordia University Montreal, Quebec


China
Z. Y. Guo, Tsighua University
Xin-Gang Liang, Tsinghua University
W.Q. Tao, School of Energy & Power Engineering, Xi'an Jiaotong University
Ping Cheng, Shanghai Jiaotong University


France
Bernard Thonon, CEA, Grenoble
Stéphane Colin, LGMT-INSAT, Toulouse Cedex 4


Germany
H. Herwig, TU Hamburg-Harburg, Germany
Norbert Kockmann, Albert-Ludwigs-University Freiburg
Rudi Kulenovic, University of Stuttgart, Stuttgard
Rainer Mertz, Universität Stuttgart, Stuttgart
Peter Stephan, University of Darmstadt, Darmstadt


India
Sushanta Kumar Mitra, IIT Bombay, INdia


Ireland
Mark Davies, University of Limerick


Israel
Gad Hetsroni, Technion


Italy
Gian Piero Celata, ENEA, Rome
Paolo Di Marco, Pisa


Japan
Nobuhide Kasagi, The University of Tokyo, Tokyo
Shigefumi Nishio, The University of Tokyo, Tokyo
Masahiro Shoji, National Institute of Advanced Industrial Science and Technology, Tsukuba


Korea
Kwang-Hyun Bang, Korea Maritime University, Busan
Moo-Hwan Kim, POSTECH, Pohang
Sang Yong Lee, Korea Advanced Institute of Science and Technology


Poland
M. Poniewski, Kielce University of Technology, Kielce
Magdalena Piasecka, Kielce University of Technology, Kielce


Sweden
Bjorn Palm, Royal Inst. of Technology


United Kingdom
John Rose, University of London, London
Vishwas Wadekar, Aspen Technologies, Oxford


USA
Richard Bergman, Corning, Inc., Corning, NY
Shih-hui (Joseph) Chao, University of Washington, Seattle, WA
Predrag Hrnjak, University of Illinois at Urbana Champaign, Urbana, IL
William Grande, Ohmcraft Inc., Honeoye Falls, NY
Nicolas G Hadjiconstantinou, Massachusetts Institute of Technology, Cambridge, MA
Thomas B. Jones, University of Rochester, Rochester, NY
Michael King, University of Rochester, Rochester, NY
D. Li, Vanderbilt University, Nashville, TN
Arun Majumdar, University of California at Berkeley, Berkeley, CA
Shirish Mulay, Lexmark International, Inc., Lexington, KY
Yoav Peles, Rensselaer Polytechnic Institute, Troy, NY

 
 

Sponsored By
   
Exhibitors
                               
This site works best with: Internet Explorer 5.0+ Netscape 7.0+ Acrobat Reader 5.0+
Note to Firefox users: Firefox is not currently supported by the Conference Toolbox.

Copyright © 1996-2008 ASME. All Rights Reserved. Terms of Use | Privacy Statement
Powered by Conference Toolbox ™ version 4.0. For more information, contact us.