Women Engineers Networking Reception
Convention Centre West · Level 2, Room 201
4:30pm - 6:00pm
Sponsored by the Center for Education and Center for Leadership and Diversity
In its third year, the reception provides a focal point at the conference for a gathering of women from the wide range of ASME activity for networking and a bit of casual relaxation at the end of a conference day. The event is open to all ASME women engineers/engineering students.
Noise Control and Acoustics Division Wine and Cheese Reception
Convention Centre West · Level 3, Room 301
4:30pm - 6:30pm
Sponsored by the Noise Control and Acoustics Division
Advanced Energy Systems Division Reception
Convention Centre West · Level 2, Room 211
4:30pm - 7:30pm
Sponsored by the Advanced Energy Systems Division
Applied Mechanics Division Honors & Awards Banquet
Convention Centre East · Meeting Room Level, Rooms 2 &
3
6:30pm - 9:30pm
Sponsored by Applied Mechanics Division
Tickets: $75
Electronic and Photonic Packaging Division Reception
Convention Centre West · Level 112, Room 109
6:30pm - 8:00pm
Sponsored by the Electronics and Photonics Packaging Division
Allan Kraus Thermal Management Medal
The Allan Kraus Thermal Management Medal, established in 2009, recognizes individuals who have demonstrated outstanding achievements in thermal management of electronic systems and their commitment to the field of thermal sciences.
2010 Recipient: Kenneth E. Goodson
KENNETH E. GOODSON, Ph.D., professor and vice chair of mechanical engineering, Stanford University, California, for fundamental and applied contributions in the area of thermal transport at very small time and length scales, including nanoscale conduction in semiconductors, high performance heat sinks, thermal interface materials, microscale boiling and nanofluids impacting thermal management of electronic devices.
Dr. Goodson was educated at the Massachusetts Institute of Technology (MIT), Cambridge, and spent two postdoctoral years with the Materials Group at Daimler-Benz AB (Ulm, Germany). He joined the faculty at Stanford University, California, in 1994, and is currently professor and vice chair of mechanical engineering. He was a Japanese Society for the Promotion of Science visiting professor at the Tokyo Institute of Technology in 1996.
His Stanford research group includes approximately 20 students, research associates and affiliated faculty. The group studies thermal transport phenomena in semiconductor nanostructures, energy conversion devices and microfluidic heat sinks, with a focus on those occurring with very small length and time scales. He is a co-founder and former chief technology officer of Cooligy, Inc. (Mountain View, Calif.), which builds microfluidic cooling systems for computers and was acquired by Emerson, Inc. in 2005.
He and his group have published more than 120 archival journal articles, 150 conference papers, and 10 books and book chapters which have been recognized through Best Paper awards at IEEE's SEMI-THERM (Semiconductor Thermal Modeling, Measurement and Management Symposium) and IEDM (International Electron Devices Meeting); TECHCON, Semiconductor Research Corporation's technical conference; and the Multilevel Interconnect Symposium. He serves as editor in chief of Nanoscale and Microscale Thermophysical Engineering. Goodson is an inventor for 29 issued U.S. patents.
An ASME member, Goodson received the ASME Journal of Heat Transfer Outstanding Reviewer Award (1999) and now serves as an associate editor for this journal.
He is a member of IEEE; the American Association for the Advancement of Science; the Materials Research Society; Sigma Xi, the Scientific Research Society; and Pi Tau Sigma and Tau Beta Pi.
Among his honors, Goodson received the Office of Naval Research's Young Investigator Award (1996-99) and the National Science Foundation's CAREER Award (1996-2000).
Goodson earned four degrees at MIT: bachelor's degrees in mechanical engineering and humanities in 1989, and a master's degree and Ph.D. in mechanical engineering in 1991 and 1993, respectively.
Fluids Engineering Division Reception
Convention Centre West · Level 2, Rooms 212-214
6:30pm - 9:30pm
Sponsored by the Fluids Engineering Executive Committee
Materials Division Honors and Awards Reception
Convention Centre East · Meeting Room Level, Room 18
6:30pm - 8:30pm
Sponsored by the Materials Division
|
